Review paper on stacking and interconnects for CMOS image sensors

In an ASME J. Electron. Packag. paper titled “Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors” Mei-Chien Lu writes:

Numerous technology breakthroughs have been made in image sensor development in the past two decades. Image sensors have evolved into a technology platform to support many applications. Their successful implementation in mobile devices has accelerated market demand and established a business platform to propel continuous innovation and performance improvement

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